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Product Overview

Product Overview

Industrial BOX-PC with fan-assisted cooling, based on Intel 11th generation Tiger Lake-U processor platform, designed for embedded computing, industrial IoT and edge control applications.

Designed for B2B automation projects, this platform helps engineering teams evaluate processor, I/O, power input, operating system, mounting method, and lifecycle requirements before RFQ.

Project-ready Highlights

Key Highlights

  • Intel 11th generation Tiger Lake-U processor platform
  • BOX-PC with fan-assisted cooling
  • M.2 NVMe/SATA + SATA3.0 storage support
  • 4 x USB3.0 + 2 x USB2.0
  • 1 x COM interface
  • DC12V-19V input

Engineering Data

Key Specifications Table

Core parameters are shown in a full-width table so procurement and engineering teams can compare configuration requirements quickly.

Processor Onboard Intel 11th generation Tiger Lake-U series processor
Chipset Intel
Memory 2 x DDR4 3200MHz SO-DIMM, up to 64GB
Storage 1 x M.2 Key-M 2280 NVMe PCIe3.0 x4 / SATA3.0 + 1 x SATA3.0
COM 1 x COM, RJ45 interface
USB 4 x USB3.0 + 2 x USB2.0
Display Output 1 x HDMI2.0, up to 4096 x 2160 @ 60Hz
Expansion MiniPCIe expansion slot and SIM card support; WiFi / 3G / 4G communication options
Power Input DC12V-19V input
Dimensions 182 x 125 x 62.5mm
Material Industrial metal enclosure
Thermal Design Fan-assisted cooling
Mounting Embedded / Wall Mount / Desktop Bracket
Operating System Windows 10 / Windows 11 / Linux

I/O Configuration

Industrial Interfaces

COM 1 x COM, RJ45 interface
USB 4 x USB3.0 + 2 x USB2.0
Display Output 1 x HDMI2.0, up to 4096 x 2160 @ 60Hz
Expansion MiniPCIe expansion slot and SIM card support; WiFi / 3G / 4G communication options

Ordering Options

Configuration Based Ordering

    Application Scenarios

    Typical Uses

    • Industrial IoT
    • Edge control
    • Embedded computing
    • Machine control
    • Industrial gateway

    Customization Options

    OEM / ODM Support

    Tell us your CPU, memory, storage, I/O, voltage, mounting, operating system, branding, packaging, and quantity requirements.

    CPU / Memory / StorageLAN / COM / USBDC12V / 9-36VMounting MethodWindows / LinuxLogo / Label / Packaging

    Quality & Compliance

    Quality & Compliance for Industrial Projects

    Project buyers can discuss compliance documents, aging test requirements, thermal design, lifecycle supply and sample validation before RFQ.

    CE / FCC / RoHS documentation support100% aging test discussion for batch ordersWide temperature and vibration reviewFanless thermal design validationLong lifecycle supply supportOEM / ODM engineering communication

    Related Resources

    Technical guides for this product selection.

    Use these guides to confirm I/O, power input, mounting, touch and project configuration requirements before RFQ.

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    Send your product model, application, quantity and I/O requirements. Our team will recommend a suitable configuration.