GUANGZHIMEI
Industrial Computing
Get a Quote
Product Overview
10.4-inch 4:3 industrial tablet PC with aluminum alloy enclosure, fanless design, capacitive touch and embedded low-power Intel processor platform.
Designed for B2B automation projects, this platform helps engineering teams evaluate processor, I/O, power input, operating system, mounting method, and lifecycle requirements before RFQ.
Project-ready Highlights
Engineering Data
Core parameters are shown in a full-width table so procurement and engineering teams can compare configuration requirements quickly.
| Processor | Intel low-power embedded 6th / 7th / 11th / 12th / 13th generation CPU options |
|---|---|
| Chipset | Intel embedded 6th / 7th / 11th / 12th / 13th generation SOC |
| Memory | 4GB / 8GB / 16GB, configuration subject to actual model |
| Storage | 1 x M.2 M Key 2280 NVMe PCIe x4 / SATA SSD adaptive slot, or 1 x 2.5-inch hard disk position |
| Screen Size | 10.4 inch |
| Resolution | 1024 x 768 |
| Brightness | 300 cd/m² optional |
| Touch Type | Capacitive G+G 10-point touch; optional resistive touch |
| Touch Performance | Response time < 8ms, touch accuracy ≤ 2mm |
| LAN | 2 x Gigabit LAN |
| COM | 2 x COM standard, optional 6COM |
| USB | 2 x USB3.0 |
| Display Output | 1 x HDMI |
| Audio | 1 x 2-in-1 audio interface |
| Expansion | 1 x M.2 Key-E 2230 for WiFi + Bluetooth module; optional GPIO 10PIN |
| Power Input | DC12V input, optional 9-36V wide voltage input |
| Operating Temperature | -10°C to 60°C |
| Storage Temperature | -40°C to 80°C |
| Humidity | 10% - 95% @ 40°C, non-condensing |
| Dimensions | TBD, bare metal |
| Panel Opening | 249 x 217mm |
| Material | High-quality aluminum alloy + steel plate |
| Thermal Design | Fanless passive heat dissipation |
| Mounting | Embedded / Wall mount / Desktop stand |
| Weight | Net 3.5kg / Gross 4.0kg |
| Operating System | 6th/7th Gen: Windows 7/10/11/Linux; 11th/12th/13th Gen: Windows 11/Linux |
I/O Configuration
Ordering Options
Application Scenarios
Customization Options
Tell us your CPU, memory, storage, I/O, voltage, mounting, operating system, branding, packaging, and quantity requirements.
Documentation
Quality & Compliance
Project buyers can discuss compliance documents, aging test requirements, thermal design, lifecycle supply and sample validation before RFQ.
